CETMK107BJ223KA-T [TAIYO YUDEN]
Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X5R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT;
| 型号： | CETMK107BJ223KA-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X5R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT |
| 文件： | 总23页 (文件大小：2586K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
大容量積層セラミックコンデンサ
HIGH VALUE MULTILAYER CERAMIC
CAPACITORS
code Temp.characteristics operating Temp. range
B
－25～＋85℃
－55～＋85℃
－55～＋125℃
－25～＋85℃
－30～＋85℃
BJ
B7
F
X5R
X7R
F
OPERATING TEMP.
Y5V
特長ꢀFEATURES
・電極にNi金属を使用し、端子電極部にメッキをしてあることにより、は
んだ付け性および耐熱性にすぐれ、マイグレーションもほとんど発生せ
・The use of Nickel(Ni) as material for both the internal and external elec-
trodes improves the solderability and heat resistance characteristics.
ず、高い信
頼性を示します
This almost completely eliminates migration and raises the level of reli-
・等価直
列抵抗（ESR）が小さく、ノイズ吸収性にすぐれています。
・特にタンタルおよびアルミ電解コンデンサに比較した場合：
高い許容リップル電流値
ability significantly.
・Low equivalent series resistance(ESR) provides excellent noise absorp-
tion characteristics.
・Compared to tantalum or aluminum electrolytic capacitors these ceramic
capacitors offer a number of excellent features, including:
高い定格電圧でありながら小型形状
絶縁抵抗、破壊電圧が高く信
頼性にすぐれている
Higher permissible ripple current values
Smaller case sizes relative to rated voltage
Improved reliability due to higher insulation resistance and break-
down voltage.
等の特徴があります
用途ꢀAPPLICATIONS
・デジタル回路全般
・General digital circuit
・Power supply bypass capacitors
Liquid crystal modules
液晶 Liquid crystal drive voltage lines
電源電圧の高いLSI、IC、OPアンプ用 LS I, I C, converters(both for input and output)
・平滑コンデンサ ・Smoothing capacitors
DC-DC converters (both for input and output)
・電源
バイパスコンデンサ
液晶
モジュール用
駆動電圧ライン用
DC-DCコンバータ（入力、出力側用）
スイッチング電源
（2次側用）
Switching power supplies (secondary side)
形名表記法ꢀORDERING CODE
1
3
5
7
9
端子電極
容量許容差
K
M
Z
個別仕様
定格電圧〔VDC〕
温度特性〔%〕
△F
＋30
－80
A
J
4
K
メッキ品
±10
±20
%
%
%
－
標準
6.3
B J
B
±10
＋80
－20
L
10
10
△＝スペース
4
E
T
G
U
16
25
35
50
包装
T
8
形状寸法〔EIA〕L×W（mm）
リールテーピング
107（0603）
212（0805）
316（1206）
325（1210）
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
製品
厚 み〔mm〕
6
K
A
D
F
0.45
0.8
0.85
1.15
1.25
1.5
1.6
1.9
2.0max
2.5
公称静電容量〔pF〕
11
例
473
当社管理記号
△
47,000
G
H
L
N
Y
M
標準品
2
105
1,000,000
△＝スペース
シリーズ名
M
積層コンデンサ
_
J M K 3 1 6 B J 1 0 6 M L T ○
6
1
2
3
4
5
7
8
9
10
11
1
3
5
7
9
Special code
End termination
Temperature characteristics code
Capacitance tolerance
〔
s %〕
Rated voltage〔VDC〕
－30～＋85℃
K
M
Z
±10
±20
K
Plated
－
Standard products
A
J
L
E
T
G
U
4
6.3
10
16
25
35
50
△F
B 7
B J
Y5V
X7R
X5R
＋22 ⁄－82％
－55～＋125℃
±15％
＋80
－20
10
Packaging
4
－55～＋85℃
±15％
△＝Blank space
8
Dimension〔s case size〕（mm）
T
Tape & reel
Thicknes〔s mm〕
107（0603）
212（0805）
316（1206）
325（1210）
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
K
0.45
0.8
0.85
1.15
1.25
1.5
6
A
D
F
G
H
L
N
Y
M
11
Nominal capacitance〔pF〕
example
473
105
Internal code
△
Standard products
△＝Blank space
47,000
1,000,000
2
1.6
1.9
Series name
M
Multilayer Ceramic Capacitors
2.0max
2.5
42
外形寸法ꢀEXTERNAL DIMENSIONS
Type（EIA）
L
W
T
e
0.45±0.05
K
A
K
D
G
D
F
*3,*4
*3,*4
（0.018±0.002）
0.35±0.25
（0.014±0.010）
□MK107
(0603)
1.6±0.10
（0.063±0.004） （0.031±0.004）
0.8±0.10
*3,*4
0.8±0.10
（0.031±0.004）
0.45±0.05
（0.018±0.002）
0.85±0.10
*1,*3
*1,*3
□MK212
（0805）
2.0±0.10
（0.079±0.004）
1.25±0.10
（0.049±0.004）
0.5±0.25
（0.020±0.010）
（0.033±0.004）
*1,*3
1.25±0.10
（0.049±0.004）
0.85±0.10
（0.033±0.004）
1.15±0.10
＋0.35
*3
*3
□MK316
(1206)
3.2±0.15
（0.126±0.006）
1.6±0.15
（0.063±0.006）
（0.045±0.004）
1.25±0.10
0.50000
－0.25
＋0.014
（
ꢀꢀ）
0.020－0.010
G
L
（0.049±0.004）
1.6±0.20
4
（0.063±0.008）
0.85±0.10
D
F
（0.033±0.004）
1.15±0.10
（0.045±0.004）
1.5±0.10
H
N
（0.059±0.004）
1.9±0.20
*2
□MK325
(1210)
3.2±0.30
（0.126±0.012）
2.5±0.20
（0.098±0.008）
0.6±0.3
（0.024±0.012）
注： ＊1. ±0.15mm公差あり
＊2. ±0.3mm公差あり
（0.075±0.008）
＋0.1
＊3. ±0.2mm公差あり
1.9
（0.075
－0.2
＊4. ＋0.15/－0.1mm公差あり
Y
＋0.004
）
Note: ＊1. Inclulding dimension tolerance±0.15mm（±0.006 inch）.
－0.008
*2
Note: ＊2. Inclulding dimension tolerance±0.3mm（±0.012 inch）.
Note: ＊3. Inclulding dimension tolerance±0.2mm（±0.008 inch）.
Note: ＊4. Inclulding dimension tolerance＋0.15/－0.1mm（＋0.006/－0.004 inch）.
2.5±0.20
（0.098±0.008）
M
Uni：t mm（inch）
概略バリエーシ ョンꢀAVAILABLE CAPACITANCE RANGE
Cap Type
TC B/X7R
107
B/X5R
212
B/X5R
316
B/X5R
325
X5R
F/Y5V
B/X7R
X5R
F/Y5V
B/X7R
X5R
F/Y5V B/X7R
B/X5R
X5R
F/Y5V
VDC
μF 3[digits]
0.022 223
0.033 333
0.047 473
0.068 683
0.1 104
0.15 154
0.22 224
0.33 334
0.47 474
0.68 684
25 16 10 35 25 16 10 6.3 10 6.3
4
50 25 16 10 50 35 25 16 10 50 35 25 16 10 6.3 25 10 6.3 50 16 10 6.3 50 35 25 16 10 6.3 25 16 10 50 10 6.3
4
35 25 16 10 25 16 10 50 35 25 16 10 50 35 16 10 6.3 16 10 6.3
A
A
A
A
A
A
G
G
A
A
G
G
G
A
A
A
A
A
L
L
A
A
A
A A
G
A A
G G
G
G
A
G
L
L
1
105
A A A A A
A A A
A A
A A
G G G G
G G
G
G G
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
47 476
100 107
G
L
L
L
N
A A
A A
G
L
L
L
L
N
G G G G
G
L
L
N N
N
M
M
N
A A
A
G
G G
G G
G
G G
L
L
L
L
L
L
L
L
L L
N
N M N M.N
N
L
L
M
M.Y
Y
N N
L
L
L
M M M.N
N
L
M
M.Y
注：グラフの記号は製 の厚 み記号です。ꢀNote : Letters in the table indicate thickness.
■低 積層セラミックコンデンサꢀLow profile Multilayer Ceramic Capacitors
Cap
Type
TC
107
212
6.3
316
6.3
325
10
B/X5R
10
X5R
6.3
B/X7R
B/X5R
16 10
X5R
6.3
F/Y5V
10
B/X7R
25
B/X5R
X5R
10
F/Y5V
B/X7R
50 25
B/X5R
16
F/Y5R
35
VDC
3[digits]
223
333
473
683
104
224
334
474
684
105
225
335
475
685
106
226
476
50
25
16
10
25
10
4
50
6.3
50
16
25
16
10
16
6.3
50
35
10
6.3
25
50
10
16
6.3
10
4
μF
0.022
0.033
0.047
0.068
0.1
D
D
D
D
0.22
0.33
0.47
0.68
1
2.2
3.3
4.7
6.8
D
F
F
K
K
D
D
D
D
D
F
F
K
K
D
D
D
・
K
K
D
K
D
D
H
K
K
K
K
K
D
D
G
H
D
D
D
D
K
D
D
・
K
D
D
D
G
D
F
H
F
D
10
22
47
D
D
・
K
D・F
D
D
D
D
D
H
F
D
D
D
D
注：グラフの記号は製 の厚 み記号です。ꢀNote : Letters in the table indicate thickness.
温度特性
Temperature characteristics
温度特性コード
Temp.char.Code
静電容量許容差〔％〕
tanδ〔%〕
Dissipation factor
Capacitance tolerance
準拠規格
Applicable standard
温度範囲〔℃〕
基
準温度〔℃〕
Ref. Temp.
静電容量変化率〔％〕
Temperature range
Capacitance change
JIS
B
－25～＋85
－55～＋85
－55～＋125
－25～＋85
－30～＋85
20
25
25
20
25
±10
±15
±15
＋30/－80
＋22/－82
BJ
B7
F
±10（K）
±20（M）
EIA
EIA
JIS
EIA
X5R
X7R
F
2.5 max.*
7.0 max.*
＋80 ꢀ
（Z）
－20
Y5V
*：代表的な値 を記載しています。詳細はアイテム一覧表を参照ください。
*：The figure indicates typical value. Please refer to PART NUMBERS table.
セレクションガイド
アイテム一覧
特性図
梱包
信
頼性
使用上の注意
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.10
P.44
P.52
P.98
P.102
P.108
etc
43
■汎用・低背
積層セラミックコンデンサꢀGeneral・Low profile Multilayer Ceramic Capacitors
アイテム一覧 PART NUMBERS
■ 107TYPE
【温度特性 Temp.char.ꢀBJ:B/X5R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
GMK107 BJ333□A
GMK107 BJ473□A
GMK107 BJ105□A*
TMK107 BJ223□A
TMK107 BJ683□A
TMK107 BJ154□A
TMK107 BJ224□A
TMK107 BJ334□A
TMK107 BJ474□A*
TMK107 BJ105□A*
EMK107 BJ105□K*
EMK107 BJ333□A
EMK107 BJ473□A
EMK107 BJ683□A
EMK107 BJ154□A*
EMK107 BJ224□A*
EMK107 BJ474□A
EMK107 BJ105□A*
EMK107 BJ225□A*
LMK107 BJ105□K*
LMK107 BJ225□K*
LMK107 BJ334□A
LMK107 BJ474□A
LMK107 BJ684□A
LMK107 BJ105□A*
LMK107 BJ225□A*
LMK107 BJ335□A*
LMK107 BJ475□A*
JMK107 BJ474□K
JMK107 BJ105□K*
JMK107 BJ225□K*
JMK107 BJ475MK*
JMK107 BJ225□A*
JMK107 BJ335□A*
JMK107 BJ475□A*
JMK107 BJ106MA*
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.033
0.047
1
0.022
0.068
0.15
0.22
0.33
0.47
1
B/X5R
B/X5R
B/X5R
B/X5R**
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
X5R
B/X5R**
B/X5R**
B/X5R**
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R
B/X5R
X5R
3.5
3.5
5
2.5
3.5
3.5
3.5
3.5
3.5
5
10
3.5
3.5
3.5
3.5
3.5
3.5
5
10
10
10
3.5
3.5
5
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.45±0.05
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.45±0.05
0.45±0.05
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.45±0.05
0.45±0.05
0.45±0.05
0.45±0.05
0.8±0.1
0.8±0.1
0.8±0.1
0.8＋0.15/ー0.1
R/W
R
35V
25V
R/W
R
1
0.033
0.047
0.068
0.15
0.22
0.47
1
2.2
1
2.2
0.33
0.47
0.68
1
2.2
3.3
4.7
0.47
1
2.2
4.7
R/W
16V
±10%
±20%
R
B/X5R**
B/X5R**
B/X5R
B/X5R**
B/X5R
X5R
R/W
10V
5
10
10
10
5
10
10
10
10
10
10
10
X5R
B/X5R
B/X5R
X5R
X5R
B/X5R
X5R
R
±20%
6.3V
2.2
3.3
4.7
10
±10%
±20%
X5R
X5R
±20%
±10%
±20%
AMK107 BJ225□K*
RoHS
2.2
X5R
10
0.45±0.05
AMK107 BJ475MK*
AMK107 BJ106MA*
AMK107 BJ226MA*
RoHS
RoHS
RoHS
4.7
10
22
X5R
X5R
X5R
10
10
10
0.45±0.05
0.8±0.1
0.8±0.2
4V
±20%
** 別仕様の取交しにより、X7R仕様に対応している場合があります。ꢀꢀꢀꢀꢀWe may provide X7R for some items according to the individual specification.
【温度特性 Temp.char.ꢀB7:X7R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
25V
16V
TMK107 B7 223□A
EMK107 B7 333□A
EMK107 B7 473□A
EMK107 B7 683□A
EMK107 B7 154□A*
EMK107 B7 224□A*
EMK107 B7 105□A*
LMK107 B7 334□A
LMK107 B7 474□A
LMK107 B7 105□A*
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.022
0.033
0.047
0.068
0.15
0.22
1
0.33
0.47
1
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
2.5
3.5
3.5
3.5
3.5
3.5
5
3.5
3.5
5
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
R/W
±10%
±20%
R
R/W
10V
R
形名の□には静電容量許容差記号が入ります。 □ Please specify the capacitance tolerance code.
* 高温負荷試験の試験電圧は定格電圧の 1.5 倍 * Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
44
アイテム一覧ꢀPART NUMBERS
【温度特性 Temp.char.ꢀF:F/Y5V】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
50V
25V
UMK107 F104ZA
TMK107 F474ZA
EMK107 F224ZA
EMK107 F474ZA
EMK107 F105ZA
EMK107 F225ZA
LMK107 F105ZA
LMK107 F225ZA
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.1
0.47
0.22
0.47
1
2.2
1
2.2
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
7
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
R/W
R
4
7
＋80％
ー20%
16V
10V
16
16
16
16
45
アイテム一覧ꢀPART NUMBERS
■ 212TYPE
【温度特性 Temp.char.ꢀ BJ:B/X5R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
UMK212 BJ223□D
UMK212 BJ333□D
UMK212 BJ473□G
UMK212 BJ683□G
UMK212 BJ104□G
UMK212 BJ154□G
UMK212 BJ224□G*
UMK212 BJ474□G*
GMK212 BJ334□G
GMK212 BJ474□G
GMK212 BJ105□G*
TMK212 BJ473□D
TMK212 BJ683□D
TMK212 BJ474□D
TMK212 BJ105□D
TMK212 BJ105□G
TMK212 BJ225□G*
TMK212 BJ475□G*
EMK212 BJ105□K*
EMK212 BJ474□D
EMK212 BJ684□D
EMK212 BJ105□D
EMK212 BJ225□D
EMK212 BJ475□D*
EMK212 BJ684□G
EMK212 BJ105□G
EMK212 BJ225□G
EMK212 BJ475□G*
EMK212 BJ106□G*
LMK212 BJ105□K
LMK212 BJ475□K*
LMK212 BJ105□D
LMK212 BJ225□D*
LMK212 BJ475□D*
LMK212 BJ106□D*
LMK212 BJ105□G
LMK212 BJ225□G
LMK212 BJ335□G
LMK212 BJ475□G
LMK212 BJ106□G
LMK212 BJ226MG
JMK212 BJ105□K
JMK212 BJ475□K*
JMK212 BJ106MK*
JMK212 BJ475□D
JMK212 BJ106□D*
JMK212 BJ226MD*
JMK212 BJ475□G
JMK212 BJ106□G
JMK212 BJ226MG*
JMK212 BJ476MG*
AMK212 BJ226MD*
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.47
0.33
0.47
1
B/X5R**
B/X5R**
B/X5R**
B/X5R**
B/X5R**
B/X5R**
B/X5R**
B/X5R
B/X5R**
B/X5R
B/X5R**
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R
B/X5R
X5R
B/X5R
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R
B/X5R**
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R
X5R
B/X5R**
B/X5R
B/X5R
X5R
B/X5R**
B/X5R**
B/X5R**
B/X5R
X5R
X5R
B/X5R
X5R
X5R
X5R
2.5
2.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
3.5
5
0.85±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.15
0.45±0.05
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.15
1.25±0.15
0.45±0.05
0.45±0.05
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.15
1.25±0.15
1.25±0.2
0.45±0.05
0.45±0.05
0.45±0.05
0.85±0.1
0.85±0.1
0.85±0.1
1.25±0.15
1.25±0.15
1.25±0.15
1.25±0.2
0.85±0.1
50V
R/W
35V
25V
0.047
0.068
0.47
1
1
5
5
R
2.2
4.7
1
0.47
0.68
1
2.2
4.7
0.68
1
2.2
4.7
10
1
4.7
1
2.2
4.7
10
10
5
3.5
3.5
5
±10%
±20%
R/W
R
5
16V
10
3.5
3.5
5
5
10
5
10
3.5
5
10
10
3.5
5
R/W
R
10V
1
R/W
2.2
3.3
4.7
10
22
1
4.7
10
4.7
10
22
4.7
10
5
5
10
10
5
10
10
10
10
10
5
10
10
10
10
±20%
±10%
±20%
±20%
±10%
±20%
±20%
±10%
±20%
R
X5R
X5R
B/X5R
X5R
X5R
6.3V
4V
22
47
22
X5R
X5R
±20%
形名の□には静電容量許容差記号が入ります。
* 高温負荷試験の試験電圧は定格電圧の 1.5 倍
** 個別仕様の取交しにより、X7R 仕様に対応している場合があります。 ** We may provide X7R for some items according to the individual specification.
□ Please specify the capacitance tolerance code.
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
46
アイテム一覧ꢀPART NUMBERS
【温度特性 Temp.char.ꢀB7:X7R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
UMK212 B7 223□D
UMK212 B7 333□D
UMK212 B7 473□G
UMK212 B7 683□G
UMK212 B7 104□G
UMK212 B7 154□G
UMK212 B7 224□G*
GMK212 B7 334□G
GMK212 B7 105□G*
TMK212 B7 473□D
TMK212 B7 683□D
TMK212 B7 105□G*
EMK212 B7 474□D
EMK212 B7 684□D
EMK212 B7 105□D
EMK212 B7 684□G
EMK212 B7 105□G
EMK212 B7 225□G*
LMK212 B7 105□D
LMK212 B7 105□G
LMK212 B7 225□G
LMK212 B7 335□G
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
1
0.047
0.068
1
0.47
0.68
1
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
2.5
2.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
5
3.5
3.5
5
3.5
3.5
10
0.85±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
0.85±0.1
0.85±0.1
1.25±0.1
0.85±0.1
0.85±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
4
50V
R/W
35V
25V
±10%
±20%
R
R/W
R
16V
10V
0.68
1
2.2
1
1
R/W
R
R/W
R
3.5
3.5
5
2.2
3.3
5
【温度特性 Temp.char.ꢀF:F/Y5V】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
UMK212 F224ZD
UMK212 F474ZG
UMK212 F105ZG
EMK212 F225ZG
LMK212 F225ZD
LMK212 F475ZG
LMK212 F106ZG
JMK212 F475ZD
JMK212 F106ZG
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.47
1
2.2
2.2
4.7
10
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
7
7
9
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
0.85±0.1
1.25±0.1
1.25±0.1
0.85±0.1
1.25±0.1
50V
16V
10V
R/W
＋80%
ー20%
9
16
16
16
R
4.7
10
6.3V
形名の□には静電容量許容差記号が入ります。 □ Please specify the capacitance tolerance code.
* 高温負荷試験の試験電圧は定格電圧の 1.5 倍 * Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.** Test Voltage of Load-
ing at high temperature test is 1.3 time of the rated voltage.
47
アイテム一覧ꢀPART NUMBERS
■ 316TYPE
【温度特性 Temp.char.ꢀBJ:B/X5R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
UMK316 BJ224□L
UMK316 BJ474□L
UMK316 BJ475□L*
GMK316 BJ684□L
GMK316 BJ105□L
TMK316 BJ105□D
TMK316 BJ225□D*
TMK316 BJ224□F
TMK316 BJ334□F
TMK316 BJ225□L
TMK316 BJ335□L
TMK316 BJ475□L*
TMK316 BJ106□L*
EMK316 BJ225□D
EMK316 BJ106□D*
EMK316 BJ684□F
EMK316 BJ105□F
EMK316 BJ106□F*
EMK316 BJ225□L
EMK316 BJ335□L
EMK316 BJ475□L
EMK316 BJ106□L*
EMK316 BJ226ML*
LMK316 BJ475□D
LMK316 BJ106□D
LMK316 BJ226MD*
LMK316 BJ335□L
LMK316 BJ475□L
LMK316 BJ106□L
LMK316 BJ226ML*
LMK316 BJ476ML*
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.47
4.7
0.68
1
B/X5R**
B/X5R**
X5R
2.5
3.5
10
3.5
3.5
3.5
3.5
2.5
2.5
3.5
3.5
5
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
0.85±0.1
0.85±0.1
1.15±0.1
1.15±0.1
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
0.85±0.1
0.85±0.1
1.15±0.1
1.15±0.1
1.15±0.1
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
0.85±0.1
0.85±0.1
0.85±0.1
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
R/W
R
50V
35V
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R**
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R
B/X5R
X5R
R/W
1
R
2.2
0.22
0.33
2.2
3.3
4.7
10
2.2
10
0.68
1
R/W
25V
16V
10V
±10%
±20%
R
5
3.5
10
3.5
3.5
10
3.5
3.5
5
5
10
5
10
10
3.5
5
B/X5R**
B/X5R**
X5R
R/W
10
R
R/W
2.2
3.3
4.7
10
22
4.7
10
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
X5R
B/X5R**
B/X5R**
B/X5R
B/X5R
X5R
±20%
±10%
±20%
22
±20%
3.3
4.7
10
22
47
±10%
±20%
5
10
10
R
±20%
±10%
±20%
JMK316 BJ106□D
RoHS
10
B/X5R
10
0.85±0.1
JMK316 BJ226MD*
JMK316 BJ476MD*
JMK316 BJ685□F
JMK316 BJ106□L
JMK316 BJ226□L
JMK316 BJ476ML
JMK316 BJ107ML*
AMK316 BJ107ML*
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
22
47
6.8
10
22
47
X5R
X5R
B/X5R
B/X5R**
X5R
X5R
X5R
X5R
10
10
10
5
10
10
10
10
0.85±0.1
0.85±0.1
1.15±0.1
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
±20%
6.3V
4V
±10%
±20%
100
100
±20%
** 個
別仕様の取交しにより、X7R 仕様に対応している場合があります。
**We may provide X7R for some items according to the individual specification
【温度特性 Temp.char.ꢀB7:X7R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
UMK316 B7 224□L
UMK316 B7 474□L
GMK316 B7 684□L
GMK316 B7 105□L
TMK316 B7 224□F
TMK316 B7 334□F
TMK316 B7 225□L
EMK316 B7 684□F
EMK316 B7 105□F
EMK316 B7 225□L
EMK316 B7 335□L
LMK316 B7 335□L
LMK316 B7 475□L
LMK316 B7 106□L*
JMK316 B7 106□L
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.47
0.68
1
0.22
0.33
2.2
0.68
1
2.2
3.3
3.3
4.7
10
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
2.5
3.5
3.5
3.5
2.5
2.5
3.5
3.5
3.5
3.5
3.5
3.5
5
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.15±0.1
1.15±0.1
1.6±0.2
1.15±0.1
1.15±0.1
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
50V
35V
R/W
25V
16V
R
±10%
±20%
R/W
10V
R
5
5
6.3V
10
形名の□には静電容量許容差記号が入ります。 □ Please specify the capacitance tolerance code.
* 高温負荷試験の試験電圧は定格電圧の 1.5 倍 * Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
48
アイテム一覧ꢀPART NUMBERS
【温度特性 Temp.char.ꢀF:F/Y5V】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
50V
35V
UMK316 F225ZG
GMK316 F475ZG
GMK316 F106ZL
TMK316 F106ZL
EMK316 F106ZL
LMK316 F475ZD
LMK316 F106ZF
LMK316 F226ZL
JMK316 F106ZD
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
2.2
4.7
10
10
10
4.7
10
22
10
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
9
9
9
R/W
1.25±0.1
1.25±0.1
1.6±0.2
1.6±0.2
1.6±0.2
0.85±0.1
1.15±0.1
1.6±0.2
0.85±0.1
4
25V
16V
＋80%
ー20%
R
9
10V
16
16
16
6.3V
■ 325TYPE
【温度特性 Temp.char.ꢀBJ:B/X5R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
±10%
±20%
UMK325 BJ105□H
RoHS
1
B/X5R**
3.5
R/W
1.5±0.1
50V
35V
UMK325 BJ475MM*
UMK325 BJ106MM*
GMK325 BJ225MN
GMK325 BJ475MN*
GMK325 BJ106MN*
TMK325 BJ106MD*
TMK325 BJ225MH
TMK325 BJ335MN
TMK325 BJ475MN*
TMK325 BJ106MN
TMK325 BJ106MM*
EMK325 BJ106MD*
EMK325 BJ226MD*
EMK325 BJ475MN
EMK325 BJ106MN
EMK325 BJ226MM*
EMK325 BJ476MM*
LMK325 BJ335MD
LMK325 BJ475MD
LMK325 BJ106MD*
LMK325 BJ226MY*
LMK325 BJ106MN
LMK325 BJ226MM
LMK325 BJ476MM*
LMK325 BJ107MM*
JMK325 BJ226MY
JMK325 BJ107MY*
JMK325 BJ476MN*
JMK325 BJ476MM*
JMK325 BJ107MM*
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
4.7
10
2.2
4.7
10
X5R
X5R
B/X5R
X5R
10
10
3.5
10
5
2.5±0.2
2.5±0.2
1.9±0.2
1.9±0.2
1.9±0.2
0.85±0.1
1.5±0.1
B/X5R
B/X5R
B/X5R**
B/X5R**
B/X5R**
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R**
B/X5R
B/X5R
X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R**
B/X5R
X5R
10
5
2.2
3.3
4.7
10
10
10
22
4.7
10
22
47
3.3
4.7
10
22
10
22
47
100
22
100
47
3.5
3.5
3.5
5
3.5
5
10
3.5
3.5
5
10
3.5
5
1.9±0.2
1.9±0.2
1.9±0.2
2.5±0.2
0.85±0.1
0.85±0.1
1.9±0.2
1.9±0.2
2.5±0.2
2.5±0.2
0.85±0.1
0.85±0.1
0.85±0.1
1.9＋0.1/ー0.2
1.9±0.2
2.5±0.2
2.5±0.2
2.5±0.3
1.9＋0.1/ー0.2
1.9＋0.1/ー0.2
1.9±0.2
2.5±0.2
2.5±0.3
25V
16V
R
±20%
5
5
10V
3.5
5
10
10
5
10
10
10
10
X5R
X5R
X5R
X5R
X5R
X5R
6.3V
47
100
形名の□には静電容量許容差記号が入ります。
* 高温負荷試験の試験電圧は定格電圧の 1.5 倍
** 個別仕様の取交しにより、X7R 仕様に対応している場合があります。 ** We may provide X7R for some items according to the individual specification.
□ Please specify the capacitance tolerance code.
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
49
アイテム一覧ꢀPART NUMBERS
【温度特性 Temp.char.ꢀB7:X7R】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
±10%
±20%
50V
25V
UMK325 B7105□H
RoHS
1
X7R
3.5
R/W
1.5±0.1
TMK325 B7225MH
TMK325 B7335MN
TMK325 B7475MN*
TMK325 B7106MN*
EMK325 B7475MN
LMK325 B7106MN
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
2.2
3.3
4.7
10
4.7
10
X7R
X7R
X7R
X7R
X7R
X7R
3.5
3.5
3.5
5
3.5
3.5
1.5±0.1
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
R
±20%
16V
10V
【温度特性 Temp.char.ꢀF:F/Y5V】
実装条件
EHS
（Environmental
Hazardous
公ꢀꢀ称
静電容量
Capacitance
〔μF〕
tanδ
Dissipation
factor
静電容量
許 容 差
Capacitance
tolerance
温度特性
Temperature
characteristics
厚
み
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
定格電圧
Rated Voltage
形ꢀꢀ名
Ordering code
Thickness
〔mm〕
Substances）
〔%〕Max.
50V
35V
16V
UMK325 F475ZH
GMK325 F106ZH
EMK325 F226ZN
LMK325 F106ZF
LMK325 F226ZN
JMK325 F476ZN
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
4.7
10
22
10
22
47
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
16
16
16
16
1.5±0.1
1.5±0.1
1.9±0.2
1.15±0.1
1.9±0.2
1.9±0.2
＋80％
ー20%
R
10V
6.3V
形名の□には静電容量許容差記号が入ります。 □ Please specify the capacitance tolerance code.
* 高温負荷試験の試験電圧は定格電圧の 1.5 倍 * Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
50
特性図ꢀELECTRICAL CHARACTERISTICS
インピーダンス・ESR－周
波数特性例 Example of Impedance ESR vs. Frequency characteristics
・当社積層セラミックコンデンサ例 (Taiyo Yuden multilayer ceramic capacitor)
AMK107BJ226MA
TMK107BJ105KA
JMK107BJ106MA
EMK212BJ105KG
EMK212BJ106KG
JMK212BJ226MG
JMK316BJ476ML
JMK316BJ107ML
TMK316BJ106KL
EMK325BJ476MM
JMK325BJ107MY
GMK325BJ106MN
52
特性図ꢀELECTRICAL CHARACTERISTICS
LMK107F225ZA
LMK107F105ZA
UMK107F104ZA
4
UMK212F105ZG
LMK212F106ZG
UMK212F224ZD
UMK316F225ZG
GMK316F106ZL
LMK316F226ZL
UMK325F475ZH
GMK325F106ZH
JMK325F476ZN
53
梱包ꢀPACKAGING
①最小受注単位数 Minimum Quantity
■テーピング梱包ꢀ Taped packagingꢀ
標準数量
製品
厚 み
Standard quantity
[ pcs ]
形式（EIA）
Thickness
Type
紙テープ エンボステープ
code
mm（inch）
paper
Embossed tape
□MK04（2 01005
）
0.2（0.008）
0.3（0.012）
0.3（0.012）
0.45（0.018）
0.3（0.012）
C
P
15000
̶
□MK063（0201）
15000
10000
10000
10000
̶
̶
̶
̶
P
□2K09（6 0302）
K
□WK105（0204）
□MK105（0402）
□VK105（0402）
P
V, W
W
K
0.5（0.020）
0.45（0.018）
0.5（0.020）
4000
̶
4000
V
̶
□MK107（0603）
□WK10（7 0306）
A
0.8（0.031）
4000
̶
Z
4000
4000
4000
4000
4000
̶
4000
4000
4000
̶
̶
̶
̶
̶
3000
̶
̶
0.5（0.020）
0.8（0.031）
0.6（0.024）
0.45（0.018）
0.85（0.033）
1.25（0.049）
0.85（0.033）
0.85（0.033）
0.85（0.033）
1.15（0.045）
1.25（0.049）
1.6（0.063）
0.85（0.033）
1.15（0.045）
1.5（0.059）
1.9（0.075）
2.0ma（x 0.079）
2.5（0.098）
2.5（0.098）
V
A
□2K11（0 0504）
B
K
□MK212（0805）
□WK21（2 0508）
D
G
D
D
D
F
□4K21（2 0805）
□2K21（2 0805）
̶
□MK316（1206）
□WK31（6 0612）
̶
̶
3000
2000
※□WK
G
L
D
F
③バルクカセットꢀBulk Cassette
̶
2000
H
N
Y
□MK325（1210）
□MK432（1812）
̶
̶
̶
2000
500,1000
500
M
M
※プレスポケットタイプは、
ꢀボトムテープ無し。
②テーピング材質ꢀTaping material
Unit：mm（inch）
105, 107, 212形状で個
別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement accord-
ing to dimensions 0402, 0603, 0805.(inch)
※□WK
98
梱包ꢀPACKAGING
③テーピング寸法ꢀTaping dimensionsꢀ
ꢀ紙テープꢀPaper Tape（8mm幅（）0.315inches wide）
エンボステープꢀEmbossed tape（8mm幅（）0.315inches wide）
部品
挿入角穴
4
T1
2.0±0.05 2.0±0.05
チップ挿入部
挿入ピッチ
テープ厚 み
Type
Chip Cavity
Insertion Pitch Tape Thickness
（ＥＩＡ）
Ａ
Ｂ
Ｆ
Ｔ
T1
チップ挿入部
Chip cavity
挿入ピッチ テープ厚 み
0.25
（0.010）
0.45
2.0±0.05
0.36max.
0.27max.
Type
□MK042（01005）
□MK063（0201）
□WK105（0204）
Insertion Pitch Tape Thickness
（0.018） （0.079±0.002） （0.014） （0.011）
（EIA）
A
B
F
K
T
0.37
（0.016）
0.67
2.0±0.05
0.45max.
0.42max.
1.0
1.8
1.3max. 0.25±0.1
（0.027） （0.079±0.002） （0.018） （0.017）
□WK107（0306）
□MK212（0805）
□MK316（1206）
（0.039） （0.071）
1.655 2.4
（0.065） （0.094）
2.0 3.6
（0.079） （0.142）
（0.051max.）（0.01±0.004）
0.65
（0.026）
1.15
2.0±0.05
0.45max 0.42max
（0.045） （0.079±0.002）（0.018max）（0.017max）
4.0±0.1
Unit：mm（inch）
（0.157±0.004）3.4max. 0.6max.
（0.134max.）（0.024max.）
部品
挿入角穴
2.8
3.6
□MK325（1210）
（0.110） （0.142）
Unit：mm（inch）
エンボステープꢀEmbossed tape（12mm幅（）0.472inches wide）
2.0±0.05 2.0±0.05
チップ挿入部
Chip Cavity
挿入ピッチ テープ厚 み
Type
Insertion Pitch Tape Thickness
（EIA）
A
B
F
T
0.72
（0.028）
0.655
1.02
52.0±0.05 0.45max.(0.018max)
□2K096（0302）
□MK105（0402）
（0.040） （0.079±0.002）0.6max.(0.024max)
1.155
52.0±0.05
0.8max.
□VK105（0402） （0.026）
（0.045） （0.079±0.002）（0.031max.）
Unit：mm（inch）
チップ挿入部
Chip cavity
挿入ピッチ テープ厚 み
Type
Insertion Pitch Tape Thickness
（EIA）
A
B
F
K
T
3.7
4.9
8.0±0.1
4.0max. 0.6max.
□MK432（1812）
（0.146）
（0.193） （0.315±0.004） （0.157max.）（0.024max.）
Unit：mm（inch）
チップ挿入部
Chip Cavity
挿入ピッチ テープ厚 み
Type
Insertion Pitch Tape Thickness
（EIA）
A
B
F
T
□MK10（7 0603）
□WK10（7 0306）
1.0
1.8
4.0±0.1
1.1max.
（0.039）
1.15
（0.071） （0.157±0.004） （0.043max.）
1.55
4.0±0.1
1.0max.
□2K110（0504）
（0.045）
（0.061） （0.157±0.004） （0.039max.）
□MK212（0805）
□WK212（0508）
1.655
2.4
□4K212（0805） （0.065）
□2K212（0805）
（0.094）
4.0±0.1
1.1max.
（0.157±0.004） （0.043max.）
□MK316（1206）
□WK316（0612）
2.0
3.6
（0.079）
（0.142）
Unit：mm（inch）
99
梱包ꢀPACKAGING
④リーダー部／空部ꢀLeader and Blank portionꢀ
160mm以上
（6.3inches or more
100mm以上
）
（3.94inches or more）
引き出し方向
Direction of tape feed
400mm以上
（15.7inches or more）
⑤リール寸法ꢀReel sizeꢀ
⑥トップテープ強度ꢀTop Tape Strengthꢀ
トップテープのはがし力は下図矢印方向にて0.1～0.7Nとなります。
The top tape requires a peel-off force of 0.1～0.7N in the direction of the
arrow as illustrated below.
100
RELIABILITY DATA
1/3
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating（Class 1）
Item
High Permitivity（Class 2）
Test Methods and Remarks
Standard
High Frequency Type
Standard Note1
BJ：－55 to ＋125℃
High Value
1.Operating Temperature
Range
－25 to ＋85℃
－55 to ＋125℃
High Capacitance Type
High Capacitance Type
BJ（X7R）：－55～＋125℃, BJ（X5R）：－55～＋85℃
E（Y5U）：－30～＋85℃, F（Y5V）：－30～＋85℃
BJ（X7R）：－55～＋125℃, BJ（X5R）：－55～＋85℃
E（Y5U）：－30～＋85℃, F（Y5V）：－30～＋85℃
F：－25 to ＋85℃
BJ：－55 to ＋125℃
F：－25 to ＋85℃
50VDC,25VDC
2.Storage Temperature
Range
－25 to ＋85℃
－55 to ＋125℃
4
3.Rated Voltage
16VDC
50VDC
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC, 2.5VDC
50VDC,25VDC,
16VDC
4.Withstanding Voltage
No abnormality
No breakdown or damage
Applied voltage: Rated voltage×3 （Class 1）
Rated voltage×2.5（Class 2）
N o b re a k d o w n o r
damage
Between terminals
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max.（Class 1,2）
5.Insulation Resistance
500 MΩμF. or 10000 MΩ., whichever is the Applied voltage: Rated voltage
10000 MΩ min.
smaller.
Duration: 60±5 sec.
Note 5
Charge/discharge current: 50mA max.
6.Capacitance（Tolerance）
0.5 to 2 pF : ±0.1 pF
2.2 to 5.1 pF : ±5%
BJ: ±10%, ±20%
＋80
BJ：±10％、±20％
F：－20％／＋80％
0.5 to 5 pF: ±0.25 pF
1 to 10pF: ±0.5 pF
5 to 10 pF: ±1 pF
11 pF or over: ± 5%
±10%
Measuring frequency：
Class1： 1ＭHz±10%（C≦1000pF）
F：
%
－20
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4
Class1：0.5～5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
105TYPER△, S△, T△, U△ only
0.5～2pF: ±0.1pF
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
2.2～20pF: ±
5%
Bias application: None
7.Q or Tangent of Loss Angle
（tan δ）
R e f e r t o d e t a i l e d BJ: 2.5% max（. 50V, 25V）
Under 30 pF
BJ：2.5％ max.
F：7％ max.
Note 4
Multilayer:
Measuring frequency：
specification
F: 5.0% max.（50V, 25V）
Note 4
: Q≧400 ＋ 20C
Class1： 1ＭHz±10%（C≦1000pF）
30 pF or over : Q≧1000
C= Nominal capacitance
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4ꢀꢀꢀꢀ Class1：0.5～5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
Bias application: None
HighーFrequencyーMultilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
8.Temperature
（Without
CH：0±60
BJ：±10％（－25～85℃）
＋30
CK：0±250
According to JIS C 5102 clause 7.12.
Temperature compensating:
BJ：±10％
Characteristic
voltage ap-
RH：－220±60
（ppm/℃）
F：
％（－25～85℃）
－80
CJ：0±120
ꢀ（－25～＋85℃）
F：＋30％／－80％
ꢀ（－25～＋85℃）
BJ（X7R、X5R）：
ꢀꢀ±15％
of Capacitance
BJ（X7R）：±15％
CH：0±60
Measurement of capacitance at 20℃ and 85℃ shall be
made to calculate temperature characteristic by the fol-
lowing equation.
plication）
＋22
F（Y5V）：ꢀꢀ％
CG：0±30
－82
RH：－220±60
SK：－330±250
SJ：－330±120
SH：－330±60
TK：－470±250
TJ：－470±120
UK：－750±250
UJ：－750±120
SL ： ＋ 350 to ー 1000
（ppm/℃）
（C85ー C20
C20×△T
）
× 106ꢀ（ppm/℃）
F（Y5V）：
High permitivity:
ꢀꢀ＋22％／－82％
Change of maximum capacitance deviation in step 1 to 5
Temperature at step 1: ＋20℃
Temperature at step 2: minimum operating temperature
Temperature at step 3: ＋20℃（Reference temperature）
Temperature at step 4: maximum operating temperature
Temperature at step 5: ＋20℃
Reference temperature for X7R, X5R, Y5U and Y5V shall be ＋25℃
9.Resistance to Flexure of
Appearance:
Appearance:
Appearance:
Warp: 1mm
Testing board: glass epoxyーresin substrate
Thickness: 1.6mm（063 TYPE : 0.8mm）
The measurement shall be made with board in the bent position.
Substrate
No abnormality
No abnormality
No abnormality
Capacitance change: Capacitance change:
Capacitance change:
Within ±5% or ±0.5 pF,
whichever is larger.
Within±0.5 pF
BJ：Within ±12.5%
F：Within ±30%
103
RELIABILITY DATA
2/3
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating（Class 1）
Standard High Frequency Type
Item
High Permittivity（Class 2）
Standard Note1 High Value
Test Methods and Remarks
10.Body Strength
No mechanical dam-
age.
High Frequency Multilayer:
Applied force: 5N
Duration: 10 sec.
4
11.Adhesion of Electrode
No separation or indication of separation of electrode.
Applied force: 5N
（01005, 0201, 0302 TYPE 2N）
Duration: 30±5 sec.
12.Solderability
At least 95% of terminal electrode is covered by new solder.
Solder temperature: 230±5℃
Duration: 4±1 sec.
13.Resistance to soldering
Appearance: No ab- Appearance: No ab- Appearance: No abnormality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
（Applicable to Class 2.）
normality
normality
Capacitance change: Within ±7.5%（BJ）
Within ±20%（F）
Capacitance change: Capacitance change:
W i t h i n ± 2.5% o r Within ±2.5%
±0.25pF, whichever is Q: Initial value
Solder temperature: 270±5℃
tan δ: Initial value
Note 4 Duration: 3±0.5 sec.
Insulation resistance: Initial value
Preheating conditions: 80 to 100℃, 2 to 5 min. or 5 to 10 min.
150 to 200℃, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the
standard condition after the test.
larger.
Insulation resistance: Withstanding voltage（between terminals）: No
Initial value abnormality
Q: Initial value
Insulation resistance: Withstanding voltage
Initial value （between terminals）:
6～24 hrs（Class 1）
Withstanding voltage No abnormality
（between terminals）:
24±2 hrs（Class 2）
No abnormality
14.Thermal shock
Appearance: No ab- Appearance: No ab- Appearance: No abnormality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
（Applicable to Class 2.）
normality
normality
Capacitance change: Within ±7.5%（BJ）
Within ±20%（F）
Capacitance change: Capacitance change:
W i t h i n ± 2.5% o r Within ±0.25pF
±0.25pF, whichever is Q: Initial value
Conditions for 1 cycle:
Note 4 Step 1: Minimum operating temperature ＋－
℃
30±3 min.
2 to 3 min.
30±3 min.
2 to 3 min.
0
tan δ: Initial value
3
Insulation resistance: Initial value
Step 2: Room temperature
Insulation resistance: Withstanding voltage（between terminals）: No Step 3: Maximum operating temperature －＋
℃
0
3
larger.
Q: Initial value
Initial value
abnormality
Step 4: Room temperature
Number of cycles: 5 times
Insulation resistance: Withstanding voltage
Initial value （between terminals）:
Recovery after the test: 6～24 hrs（Class 1）
24±2 hrs（Class 2）
Withstanding voltage No abnormality
（between terminals）:
No abnormality
15.Damp Heat（steady state） Appearance: No ab- Appearance: No ab- Appearance: No ab- Appearance: No ab- Multilayer：
normality
normality
normality
normality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
（Applicable to Class 2.）
Capacitance change: Capacitance change: Capacitance change:
Capacitance change:
BJ:Within ±12.5%
Note 4
BJ: Within ±12.5%
F: Within ±30%
tan δ: BJ: 5.0% max.
F: 7.5% max.
Within ±5% or ±0.5pF, Within ±0.5pF,
Temperature: 40±2℃
whichever is larger.
Q:
Insulation resistance:
1000 MΩ min.
Humidity: 90 to 95% RH
＋24
tan δ:
Duration: 500 － hrs
0
BJ: 5.0% max. Note 4.
F: 11.0% max.
Insulation resistance:
50 MΩμF or 1000 MΩ
whichever is smaller.
Note 5
C≧30 pF : Q≧350
10 ≦ C＜ 30 pF: Q≧
275 ＋ 2.5C
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6～24 hrs（Class 1）
Note 4
Insulation resistance:
50 MΩμF or 1000 MΩ
whichever is smaller.
Note 5
C＜10 pF
＋ 10C
: Q≧200
24±2 hrs（Class 2）
HighーFrequency Multilayer:
C: Nominal capacitance
Insulation resistance:
1000 MΩ min.
Temperature: 60±2℃
Humidity: 90 to 95% RH
＋24
Duration: 500 － hrs
0
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6～24 hrs（Class 1）
105
RELIABILITY DATA
3/3
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating（Class 1）
Standard High Frequency Type
Item
High Permittivity（Class 2）
Test Methods and Remarks
Standard Note1
High Value
16.Loading under Damp Heat Appearance: No ab- Appearance: No ab-
normality normality
According to JIS C 5102 Clause 9. 9.
Multilayer:
Appearance: No ab-
normality
Appearance: No ab-
normality
Capacitance change: Capacitance change:
Within ±7.5% or ± C≦2 pF:Within ±0.4 pF
0.75pF, whichever is C＞2 pF: Within ±0.75
Preconditioning: Voltage treatment（Class 2）
Temperature: 40±2℃
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
Capacitance change:
BJ：Within±12.5％
F：Within±30％
Note 4
4
Humidity: 90 to 95% RH
＋24
larger.
pF
Duration: 500 － hrs
0
Q: C≧30 pF: Q≧200
C＜30 pF: Q≧100 ＋ tance
10C/3
C ： Nominal capaci-
Applied voltage: Rated voltage
tan δ: BJ: 5.0% max.
F: 7.5% max.
tanδ：
BJ：5.0％max.
F：11％max.
Charge and discharge current: 50mA max.（Class 1,2）
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
6～24 hrs（Class 1）
24±2 hrs（Class 2）
HighーFrequency Multilayer:
Insulation resistance:
Note 4
C ： Nominal capaci- 500 MΩ min.
tance
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
Note 4
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
Insulation resistance:
500 MΩ min.
Temperature: 60±2℃
Humidity: 90 to 95% RH
＋24
Duration: 500
hrs
－
0
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 6～24 hrs of recovery under the standard
condition after the removal from test chamber.
17.Loading at High Tempera-
Appearance: No ab- Appearance: No ab-
According to JIS C 5102 clause 9.10.
Multilayer:
Appearance: No abnormality
Capacitance change:
BJ：Within±12.5％
Within±20％※※
Within±25％※※
F：Within±30％
Note 4
ture
normality
normality
Appearance: No ab-
normality
Capacitance change:
Within ±3% or
±0.3pF, whichever is
larger.
Capacitance change:
Within ±3% or ±
0.3pF, whichever is
larger.
Preconditioning: Voltage treatment（Class 2）
Temperature:125±3℃（Class 1, Class 2: B, BJ（X7R）
）
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
85±2℃（Class 2: BJ,F）
＋48
Duration: 1000－ hrs
0
Q: C≧30 pF : Q≧350 Insulation resistance:
Applied voltage: Rated voltage×2 Note 6
10≦C＜30 pF: Q≧275
＋ 2.5C
C＜10 pF: Q≧200 ＋
10C
1000 MΩ min.
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
ꢀꢀꢀ6～24 hrs（Class 1）
tan δ:
BJ: 4.0% max.
tanδ：
BJ：5.0％max.
F：11％max.ꢀ
Note 4
F: 7.5% max.
ꢀꢀꢀ 24±2 hrs（Class 2）
Note 4
C：Nominal
capacitance
HighーFrequency Multilayer:
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
Temperature: 125±3℃（Class 1）
＋48
Insulation resistance:
1000 MΩ min.
Duration: 1000－ hrs
0
Applied voltage: Rated voltage×2
Recovery: 6～24 hrs of recovery under the standard
condition after the removal from test chamber.
Note 1
Note 2
Note 3
:For 105 type, specified in "High value".
:Thermal treatment（Multilayer）: 1 hr of thermal treatment at 150 ＋0 /－10 ℃ followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
Voltage treatment（Multilayer）: 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
:
Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications.
Note 6 :Some of the parts are applicable in rated voltage×1.5. Please refer to individual specifications.
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative
humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
107
PRECAUTIONS
1/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
1.Circuit Design
Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear
reactors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
4
Operating Voltage（Verification of Rated voltage）
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.（larger fillets which extend above the component
end terminations）
2.PCB Design
Pattern configurations
（Design of Land-patterns）
1. When capacitors are mounted on a PCB, the amount of
solder used（size of fillet）can directly affect capacitor per-
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
（1）The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
Examples of improper pattern designs are also shown.
（1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs
Recommended land dimensions for wave-soldering（unit: mm）
（2）When more than one part is jointly soldered onto the
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
Type
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
L
Size
W
51.25
A
0.8～1.0 1.0～1.4 1.8～2.5 1.8～2.5
0.5～0.8 0.8～1.5 0.8～1.7 0.8～1.7
0.6～0.8 0.9～1.2 1.2～1.6 1.8～2.5
B
C
Recommended land dimensions for reflow-soldering（unit: mm）
Type
042
0.4
0.2
063
0.6
0.3
105
1.0
0.5
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
432
4.5
3.2
L
Size
W
51.25
A
0.15～0.25 0.20～0.30 0.45～0.55 0.8～1.0 0.8～1.2 1.8～2.5 1.8～2.5 2.5～3.5
0.10～0.20 0.20～0.30 0.40～0.50 0.6～0.8 0.8～1.2 1.0～1.5 1.0～1.5 1.5～1.8
0.15～0.30 0.25～0.40 0.45～0.55 0.6～0.8 0.9～1.6 1.2～2.0 1.8～3.2 2.3～3.5
B
C
Excess solder can affect the ability of chips to withstand mechanical stresses. There-
fore, please take proper precautions when designing land-patterns.
Type 212（4 circuits）
2.0
L
1.25
W
a
b
c
d
0.5～0.6
0.5～0.6
0.2～0.3
0.5
Type 212（2 circuits） 110（2 circuits）096（2 circuits）
L
2.0
1.37
1.0
0.9
0.6
1.25
W
a
b
c
d
0.5～0.6
0.5～0.6
0.5～0.6
1.0
0.35～0.45 0.25～0.35
0.55～0.65 0.15～0.25
0.3～0.4
0.64
0.15～0.25
0.45
109
PRECAUTIONS
2/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
LWDC Recommended land dimensions for reflow-soldering
4
105
1.0
107
51.6
0.8
212
2.0
316
3.2
1.6
Type
W
0.52
1.25
L
A
B
C
0.18～0.22 0.25～0.3 0.5～0.7 0.8~1.0
0.2～0.25 0.3～0.4 0.4～0.5 0.4~0.5
0.9～1.1 1.5～1.7 1.9～2.1 3.0～3.4
（unit: mm）
2.PCB Design
（2）Examples of good and bad solder application
Not recommended
Recommended
Items
Mixed mounting
of SMD and
leaded compo-
nents
Component
placement close
to the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Pattern configurations
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should
（Capacitor layout on panelized [breakaway] PC boards）
1. After capacitors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
manufacturing processes（PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave
soldering the reflow soldered boards etc.） For this reason,
planning pattern configurations and the position of SMD ca-
pacitors should be carefully performed to minimize stress.
be located to minimize any possible mechanical stresses from board warp or deflection.
Not recommended
Recommended
Deflection of
the board
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the
amount of mechanical stresses given will vary depending on capacitor layout. The
example below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress
on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving,
and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB
splitting procedure.
111
PRECAUTIONS
3/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
3.Considerations for auto-
Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
matic placement
1. Excessive impact load should not be imposed on the ca-
pacitors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
（1）The lower limit of the pick-up nozzle should be adjusted to the surface level of the
PC board after correcting for deflection of the board.
4
（2）The pick-up pressure should be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up
nozzle, supporting pins or back-up pins should be used under the PC board. The fol-
lowing diagrams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between
the shrinkage percentage of the adhesive and that of the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much
adhesive applied to the board may adversely affect component placement, so the fol-
lowing precautions should be noted in the application of adhesives.
1. Mounting capacitors with adhesives in preliminary assembly,
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period.
Therefore, it is imperative to consult the manufacturer of the
adhesives on proper usage and amounts of adhesive to use.
（1）Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mount-
ing & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2）The recommended amount of adhesives is as follows;
Figure
212/316 case sizes as examples
0.3mm min
a
b
c
100 ～120 μm
Adhesives should not contact the pad
113
PRECAUTIONS
4/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
4. Soldering
Precautions
Technical considerations
Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate
the flux, or highly acidic flux is used, an excessive amount of residue after soldering
may lead to corrosion of the terminal electrodes or degradation of insulation resis-
tance on the surface of the capacitors.
1. Since flux may have a significant effect on the performance
of capacitors, it is necessary to verify the following condi-
tions prior to use;
（1）Flux used should be with less than or equal to 0.1 wt%
（equivelent to chroline）of halogenated content. Flux
having a strong acidity content should not be applied.
（2）When soldering capacitors on the board, the amount of
flux applied should be controlled at the optimum level.
（3）When using water-soluble flux, special care should be
taken to properly clean the boards.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a
large amount of flux gas may be emitted and may detrimentally affect solderability. To
minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the
air, the residue on the surface of capacitors in high humidity conditions may cause a
degradation of insulation resistance and therefore affect the reliability of the compo-
nents. The cleaning methods and the capability of the machines used should also be
considered carefully when selecting water-soluble flux.
4
Soldering
1-1. Preheating when soldering
Temperature, time, amount of solder, etc. are specified in ac-
cordance with the following recommended conditions.
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
Cooling: The temperature difference between the components and cleaning process
should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling. Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
[Reflow soldering]
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact us prior to usage.
Temperature profile
Temperature（℃）
（Pb free soldering）
300
Peak 260℃ max
10 sec max
200
100
0
Gradually
cooling
Preheating
150℃
60 sec min
Heating above 230℃
40 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass （fillet）controlled to 1/2 to 1/3 of the
thickness of the capacitor, as shown below:
Capacitor
Solder
PC board
2. Because excessive dwell times can detrimentally affect solderability, soldering du-
ration should be kept as close to recommended times as possible.
[Wave soldering]
Temperature profile
Temperature（℃）
（Pb free soldering）
300
Peak 260℃ max
10 sec max
200
100
0
Gradually
cooling
Preheating
150℃
120 sec min
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
greater than 100 to 130℃
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow sol-
dering only.
115
PRECAUTIONS
5/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
[Hand soldering]
4. Soldering
ꢀTemperature profile
Temperature（℃）
（Pb free soldering）
400
300
200
350℃ max
3 sec max
Gradually
cooling
⊿Ｔ
4
100
0
60 sec min
（※⊿Ｔ≦190℃（3216Type max）, ⊿Ｔ≦130℃（3225
Type min）
）
直
※It is recommended to use 20W soldering iron and
the tip is 1φor less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
5.Cleaning
Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue
to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a
degradation of the capacitor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimen-
tally affect the performance of the capacitors.
1. When cleaning the PC board after the capacitors are all
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning（e.g.
to remove soldering flux or other materials from the produc-
tion process.）
2. Cleaning conditions should be determined after verifying, （1）Excessive cleaning
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
In the case of ultrasonic cleaning, too much power output can cause excessive vibra-
tion of the PC board which may lead to the cracking of the capacitor or the soldered
portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output
Below 20 W/ℓ
Below 40 kHz
Ultrasonic frequency
Ultrasonic washing period 5 min. or less
6.Post cleaning processes
1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the hard-
ening period or while left under normal storage conditions
resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recom-
mended.
Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
7.Handling
2. Board separation should not be done manually, but by us-
ing the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive me-
chanical shocks.
（1）If ceramic capacitors are dropped onto the floor or a
hard surface, they should not be used.
（2）When handling the mounted boards, be careful that the
mounted components do not come in contact with or
bump against other boards or components.
117
PRECAUTIONS
6/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
8.Storage conditions
Storage
1. If the parts are stored in a high temperature and humidity environment, problems
such as reduced solderability caused by oxidation of terminal electrodes and dete-
rioration of taping/packaging materials may take place. For this reason, components
should be used within 6 months from the time of delivery. If exceeding the above
period, please check solderability before using the capacitors.
1. To maintain the solderability of terminal electrodes and to
keep the packaging material in good condition, care must
be taken to control temperature and humidity in the storage
area. Humidity should especially be kept as low as possible.
・Recommended conditions
4
Ambient temperature
Humidity
Below 30℃
Below 70% RH
The ambient temperature must be kept below 40℃. Even
under ideal storage conditions capacitor electrode solder-
ability decreases as time passes, so should be used within
6 months from the time of delivery.
・Ceramic chip capacitors should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
（type 2 &3）will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150℃ for 1hour will return the capacitance to its initial level.
119
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Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
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